Near Void-Free Assembly Development of Flip Chip Using...

IEEE Transactions on Electronics Packaging Manufacturing 2009 Vol. 32; Iss. 2

Near Void-Free Assembly Development of Flip Chip Using No-Flow Underfill

Sangil Lee, Myung Jin Yim, Master, R.N., Wong, C.P., Baldwin, D.F.
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Volume:
32
Year:
2009
Language:
english
DOI:
10.1109/tepm.2009.2015592
File:
PDF, 1.72 MB
english, 2009
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