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Ti/Au Die Backside Metallization for Flip Chip Heat Spreader Attachment
Yuquan Li, Johnson, R.W., Zhang, R., Henson, P., Thompson, P., Hooghan, T., Libres, J.Volume:
33
Year:
2010
Language:
english
DOI:
10.1109/tepm.2009.2037012
File:
PDF, 5.18 MB
english, 2010