Effects of Vacuum Ultraviolet Surface Treatment on the...

IEEE Transactions on Electronics Packaging Manufacturing 2010 Vol. 33; Iss. 3

Effects of Vacuum Ultraviolet Surface Treatment on the Bonding Interconnections for Flip Chip and 3-D Integration

Sakuma, K., Mizuno, J., Nagai, N., Unami, N., Shoji, S.
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Volume:
33
Year:
2010
Language:
english
DOI:
10.1109/tepm.2010.2048917
File:
PDF, 2.51 MB
english, 2010
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