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Role of Ti/Al relative thickness in the formation mechanism of Ti/Al/Ni/Au Ohmic contacts to AlGaN/GaN heterostructures
Kong, Xin, Wei, Ke, Liu, Guoguo, Liu, XinyuVolume:
45
Language:
english
Journal:
Journal of Physics D: Applied Physics
DOI:
10.1088/0022-3727/45/26/265101
Date:
July, 2012
File:
PDF, 974 KB
english, 2012