[IEEE 2008 58th Electronic Components and Technology...

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[IEEE 2008 58th Electronic Components and Technology Conference (ECTC 2008) - Lake Buena Vista, FL, USA (2008.05.27-2008.05.30)] 2008 58th Electronic Components and Technology Conference - Manufacture and ultra-high frequency performance of an LCP-based, Z-interconnect, flip-chip package

Rowlands, Michael J., Das, Rabindra N.
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Year:
2008
Language:
english
DOI:
10.1109/ectc.2008.4550153
File:
PDF, 547 KB
english, 2008
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