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Selective Chemical Vapor Deposition of Manganese Self-Aligned Capping Layer for Cu Interconnections in Microelectronics
Au, Yeung, Lin, Youbo, Kim, Hoon, Beh, Eugene, Liu, Yiqun, Gordon, Roy G.Volume:
157
Year:
2010
Language:
english
Journal:
Journal of The Electrochemical Society
DOI:
10.1149/1.3364799
File:
PDF, 648 KB
english, 2010