[IEEE 2011 IEEE 13th Electronics Packaging Technology Conference - (EPTC 2011) - Singapore, Singapore (2011.12.7-2011.12.9)] 2011 IEEE 13th Electronics Packaging Technology Conference - Electroless Ni-W-P alloy as a more enduring and reliable soldering metallization
Yang, Y., Balaraju, J. N., Tsakadze, Z., Chen, Z.Year:
2011
Language:
english
DOI:
10.1109/eptc.2011.6184383
File:
PDF, 1004 KB
english, 2011