Electromigration in Cu(Al) and Cu(Mn) damascene lines

Journal of Applied Physics 2012 Vol. 111; Iss. 9

Electromigration in Cu(Al) and Cu(Mn) damascene lines

Hu, C.-K., Ohm, J., Gignac, L. M., Breslin, C. M., Mittal, S., Bonilla, G., Edelstein, D., Rosenberg, R., Choi, S., An, J. J., Simon, A. H., Angyal, M. S., Clevenger, L., Maniscalco, J., Nogami, T., P
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Volume:
111
Year:
2012
Language:
english
Journal:
Journal of Applied Physics
DOI:
10.1063/1.4711070
File:
PDF, 1.08 MB
english, 2012
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