Gold–Aluminum Intermetallic Formation Kinetics

IEEE Transactions on Device and Materials Reliability 2007 Vol. 7; Iss. 1

Gold–Aluminum Intermetallic Formation Kinetics

Blish, R.C., Li, S., Kinoshita, H., Morgan, S., Myers, A.F.
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Volume:
7
Year:
2007
Language:
english
DOI:
10.1109/tdmr.2007.891533
File:
PDF, 1.76 MB
english, 2007
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