Surface Modification of Si Wafer by Low-Pressure High-Frequency Plasma Chemical Vapor Deposition Method
Yuji, Toshifumi, Mungkung, Narong, Kiyota, Yuichi, Uesugi, Daishiro, Kawano, Minobu, Nakabayashi, Kenichi, Kataoka, Hisaaki, Suzaki, Yoshifumi, Kashihara, Nobuki, Akatsuka, HiroshiVolume:
39
Language:
english
Journal:
IEEE Transactions on Plasma Science
DOI:
10.1109/tps.2011.2140383
Date:
June, 2011
File:
PDF, 420 KB
english, 2011