Effects of Contact Area on Mechanical Strength, Electrical...

Electrochemical and Solid-State Letters 2010 Vol. 13; Iss. 6

Effects of Contact Area on Mechanical Strength, Electrical Resistance, and Electromigration Reliability of Cu/Low-k Interconnects

Yang, C.-C., Shaw, T., Simon, A., Edelstein, D.
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Volume:
13
Year:
2010
Language:
english
Journal:
Electrochemical and Solid-State Letters
DOI:
10.1149/1.3373524
File:
PDF, 738 KB
english, 2010
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