Copper Interconnect Electromigration Behavior in Various...

Japanese Journal of Applied Physics 2006 / 2 Vol. 45; Iss. 2A

Copper Interconnect Electromigration Behavior in Various Structures and Precise Bimodal Fitting

Lin, M. H., Lin, Y. L., Chang, K. P., Su, K. C., Wang, Tahui
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Volume:
45
Language:
english
Journal:
Japanese Journal of Applied Physics
DOI:
10.1143/jjap.45.700
Date:
February, 2006
File:
PDF, 409 KB
english, 2006
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