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[IEEE 2012 IEEE 62nd Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2012.05.29-2012.06.1)] 2012 IEEE 62nd Electronic Components and Technology Conference - Design and fabrication of low-loss horizontal and vertical interconnect links using air-clad transmission lines and through silicon vias
Sharma, Rohit, Uzunlar, Erdal, Kumar, Vachan, Saha, Rajarshi, Yeow, Xinyi, Bashirullah, Rizwan, Naeemi, Azad, Kohl, PaulYear:
2012
Language:
english
DOI:
10.1109/ectc.2012.6249115
File:
PDF, 2.05 MB
english, 2012