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[IEEE 2007 Proceedings 57th Electronic Components and Technology Conference - Sparks, NV, USA (2007.05.29-2007.06.1)] 2007 Proceedings 57th Electronic Components and Technology Conference - Transient Dynamic Simulation and Full-Field Test Validation for A Slim-PCB Of Mobile Phone under Drop / Impact
Park, Seungbae, Shah, Chirag, Kwak, Jae, Jang, Changsoo, Pitarresi, James, Park, Taesang, Jang, SeyoungYear:
2007
Language:
english
DOI:
10.1109/ectc.2007.373907
File:
PDF, 6.04 MB
english, 2007