[IEEE 2011 International Symposium on Advanced Packaging Materials (APM) - Xiamen, China (2011.10.25-2011.10.28)] 2011 International Symposium on Advanced Packaging Materials (APM) - A comparison of two board level mechanical tests-drop impact and vibration shock
Yang, Liu, Fenglian, Sun, Hongwu, Zhang, Zhen, Zhou, Yong, QinYear:
2011
Language:
english
DOI:
10.1109/isapm.2011.6105699
File:
PDF, 159 KB
english, 2011