An enhanced quasi-monolithic integration technology for...

IEEE Transactions on Advanced Packaging 2003 Vol. 26; Iss. 4

An enhanced quasi-monolithic integration technology for microwave and millimeter wave applications

Joodaki, M., Kompa, G., Hillmer, H.
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Volume:
26
Year:
2003
Language:
english
DOI:
10.1109/tadvp.2003.821637
File:
PDF, 1.57 MB
english, 2003
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