[IEEE 7th. Int. Conf. on Thermal, Mechanical and...

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[IEEE 7th. Int. Conf. on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems - Como, Italy (24-26 April 2006)] 7th. Int. Conf. on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems - Multiphysics Softwares Benchmark on Ansys / Comsol Applied For RF MEMS Switches Packaging Simulations

Peyrou, D., Pons, P., Granier, H., Leray, D., Ferrand, A., Yacine, K., Saadaoui, M., Nicolas, A., Tao, J.W., Plana, R.
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Year:
2006
Language:
english
DOI:
10.1109/esime.2006.1644011
File:
PDF, 7.07 MB
english, 2006
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