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A mechanical de-tethering technique for silicon MEMS etched with a DRIE process
Hériban, D, Agnus, J, Petrini, V, Gauthier, MVolume:
19
Language:
english
Journal:
Journal of Micromechanics and Microengineering
DOI:
10.1088/0960-1317/19/5/055011
Date:
May, 2009
File:
PDF, 1.43 MB
english, 2009