[IEEE 2012 IEEE 62nd Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2012.05.29-2012.06.1)] 2012 IEEE 62nd Electronic Components and Technology Conference - Low cost 3D multilevel interconnect integration for RF and microwave applications
Ghannam, Ayad, Bourrier, David, Ourak, Lamine, Viallon, Christophe, Parra, ThierryYear:
2012
Language:
english
DOI:
10.1109/ectc.2012.6249010
File:
PDF, 1.84 MB
english, 2012