Flip-Chip-Assembled $W$-Band CMOS Chip Modules on Ceramic...

IEEE Transactions on Microwave Theory and Techniques 2012 / 03 Vol. 60; Iss. 3

Flip-Chip-Assembled $W$-Band CMOS Chip Modules on Ceramic Integrated Passive Device With Transition Compensation for Millimeter-Wave System-in-Package Integration

Lu, Hsin-Chia, Kuo, Che-Chung, Lin, Po-An, Tai, Chen-Fang, Chang, Yi-Long, Jiang, Yu-Sian, Tsai, Jeng-Han, Hsin, Yue-Ming, Wang, Huei
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Volume:
60
Language:
english
Journal:
IEEE Transactions on Microwave Theory and Techniques
DOI:
10.1109/tmtt.2011.2176747
Date:
March, 2012
File:
PDF, 3.24 MB
english, 2012
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