[IEEE 2009 IEEE International Electron Devices Meeting (IEDM) - Baltimore, MD, USA (2009.12.7-2009.12.9)] 2009 IEEE International Electron Devices Meeting (IEDM) - First CMOS integration of ultra thin body and BOX (UTB2) structures on bulk direct silicon bonded (DSB) wafer with multi-surface orientations
Bidal, G., Boeuf, F., Denorme, S., Laviron, C., Bourdelle, K., Loubet, N., Campidelli, Y., Beneyton, R., Moriceau, H., Fournel, F., Morin, P., Barnola, S., Salvetat, T., Perreau, P., Gouraud, P., LeveYear:
2009
Language:
english
DOI:
10.1109/iedm.2009.5424247
File:
PDF, 5.04 MB
english, 2009