A 3-D Cache With Ultra-Wide Data Bus for 3-D Processor-Memory Integration
Zia, A., Jacob, P., Jin-Woo Kim, Chu, M., Kraft, R.P., McDonald, J.F.Volume:
18
Year:
2010
Language:
english
DOI:
10.1109/tvlsi.2009.2017750
File:
PDF, 4.99 MB
english, 2010