Wafer-Level Vacuum Packaging for MEMS Resonators Using...

Journal of Microelectromechanical Systems 2012 / 12 Vol. 21; Iss. 6

Wafer-Level Vacuum Packaging for MEMS Resonators Using Glass Frit Bonding

Wu, Guoqiang, Xu, Dehui, Xiong, Bin, Wang, Yuchen, Wang, Yuelin, Ma, Yinglei
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
21
Language:
english
Journal:
Journal of Microelectromechanical Systems
DOI:
10.1109/jmems.2012.2211572
Date:
December, 2012
File:
PDF, 1.40 MB
english, 2012
Conversion to is in progress
Conversion to is failed