A bonding technique using hydrophilic SU-8

Journal of Micromechanics and Microengineering 2007 / 10 Vol. 17; Iss. 10

A bonding technique using hydrophilic SU-8

Chen, Yu-Tzu, Lee, Denz
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Volume:
17
Language:
english
Journal:
Journal of Micromechanics and Microengineering
DOI:
10.1088/0960-1317/17/10/008
Date:
October, 2007
File:
PDF, 983 KB
english, 2007
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