A low-temperature wafer bonding technique using patternable...

A low-temperature wafer bonding technique using patternable materials

Pan, C-T, Yang, H, Shen, S-C, Chou, M-C, Chou, H-P
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Volume:
12
Language:
english
Journal:
Journal of Micromechanics and Microengineering
DOI:
10.1088/0960-1317/12/5/315
Date:
September, 2002
File:
PDF, 415 KB
english, 2002
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