![](/img/cover-not-exists.png)
Failure analysis of solder joints with a damage-coupled viscoplastic model
Y. Wei, C. L. Chow, M. K. Neilsen, H. E. FangVolume:
56
Year:
2003
Language:
english
Pages:
13
DOI:
10.1002/nme.660
File:
PDF, 159 KB
english, 2003