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Carbon Nanotube Based Polymer Adhesive as an Underfill for Superconductor Multi-Chip Module Packaging
John, Ranjith S. E., Thompson, Corey S., Dotsenko, Vladimir V., Delmas, Jean, Malshe, Ajay P., Gupta, DeepnarayanVolume:
21
Language:
english
Journal:
IEEE Transactions on Applied Superconductivity
DOI:
10.1109/tasc.2010.2083611
Date:
June, 2011
File:
PDF, 720 KB
english, 2011