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Electroless Nickel Ternary Alloy Deposition on SiO[sub 2] for Application to Diffusion Barrier Layer in Copper Interconnect Technology
Osaka, Tetsuya, Takano, Nao, Kurokawa, Tetsuya, Kaneko, Tomomi, Ueno, KazuyoshiVolume:
149
Year:
2002
Language:
english
Journal:
Journal of The Electrochemical Society
DOI:
10.1149/1.1512669
File:
PDF, 883 KB
english, 2002