Optimization of copper wire bonding on Al-Cu metallization

Optimization of copper wire bonding on Al-Cu metallization

Nguyen, L.T., McDonald, D., Danker, A.R., Ng, P.
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Volume:
18
Year:
1995
Language:
english
DOI:
10.1109/95.390327
File:
PDF, 710 KB
english, 1995
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