[IEEE 2011 IEEE International 3D Systems Integration Conference (3DIC) - Osaka (2012.01.31-2012.02.2)] 2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International - Analysis of microbump induced stress effects in 3D stacked IC technologies
Ivankovic, A., Van der Plas, G., Moroz, V., Choi, M., Cherman, V., Mercha, A., Marchal, P., Gonzalez, M., Eneman, G., Zhang, W., Buisson, T., Detalle, M., Manna, A. L., Verkest, D., Beyer, G., Beyne,Year:
2012
Language:
english
DOI:
10.1109/3dic.2012.6262972
File:
PDF, 765 KB
english, 2012