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[IEEE 2007 International Microsystems, Packaging, Assembly and Circuits Technology - Taipei, Taiwan (2007.10.1-2007.10.3)] 2007 International Microsystems, Packaging, Assembly and Circuits Technology - Investigation of the hysteresis phenomenon of a silicon-based piezoresistive pressure sensor
Hsin-Nan Chiang,, Tsung-Lin Chou,, Chun-Te Lin,, Kuo-Ning Chiang,Year:
2007
Language:
english
DOI:
10.1109/impact.2007.4433592
File:
PDF, 345 KB
english, 2007