3-D-integrated RF and millimeter-wave functions and modules...

IEEE Transactions on Advanced Packaging 2004 Vol. 27; Iss. 2

3-D-integrated RF and millimeter-wave functions and modules using liquid crystal polymer (LCP) system-on-package technology

Tentzeris, M.M., Laskar, J., Papapolymerou, J., Pinel, S., Palazzari, V., Li, R., DeJean, G., Papageorgiou, N., Thompson, D., Bairavasubramanian, R., Sarkar, S., Lee, J.-H.
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
27
Year:
2004
Language:
english
DOI:
10.1109/tadvp.2004.828814
File:
PDF, 917 KB
english, 2004
Conversion to is in progress
Conversion to is failed