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[IEEE 2007 International Conference on Electronic Materials and Packaging (EMAP 2007) - Daejeon, Korea (2007.11.19-2007.11.22)] 2007 International Conference on Electronic Materials and Packaging - Planar antennas on flexible substrate for wireless applications
Hsien-Chiao Teng,, Pei-Ju Lin,, Ming-Kun Chen,, Yu-Jung Huang,, Shen-Li Fu,Year:
2007
Language:
english
DOI:
10.1109/emap.2007.4510289
File:
PDF, 5.11 MB
english, 2007