[IEEE 2010 12th Electronics Packaging Technology Conference - (EPTC 2010) - Singapore, Singapore (2010.12.8-2010.12.10)] 2010 12th Electronics Packaging Technology Conference - Factors affecting electromigration and current carrying capacity of FC and 3D IC interconnects
Syed, AhmerYear:
2010
Language:
english
DOI:
10.1109/eptc.2010.5702698
File:
PDF, 1.79 MB
english, 2010