Design of AlN-based micro-channel heat sink in direct bond copper for power electronics packaging
Yin, Shan, Tseng, King Jet, Zhao, JiyunVolume:
52
Language:
english
Journal:
Applied Thermal Engineering
DOI:
10.1016/j.applthermaleng.2012.11.014
Date:
April, 2013
File:
PDF, 826 KB
english, 2013