Yield Enhancement by Bad-Die Recycling and Stacking With...

IEEE Transactions on Very Large Scale Integration (VLSI) Systems 2011 Vol. 19; Iss. 8

Yield Enhancement by Bad-Die Recycling and Stacking With Though-Silicon Vias

Yung-Fa Chou, Ding-Ming Kwai, Cheng-Wen Wu
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Volume:
19
Year:
2011
Language:
english
DOI:
10.1109/tvlsi.2010.2051466
File:
PDF, 1.37 MB
english, 2011
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