Direct Copper Electrochemical Deposition on Ru-Based Substrates for Advanced Interconnects Target 30 nm and 1/2 Pitch Lines: From Coupon to Full-Wafer Experiments
Armini, S., El-Mekki, Z., Swerts, J., Nagar, M., Demuynck, S.Volume:
160
Language:
english
Journal:
Journal of the Electrochemical Society
DOI:
10.1149/2.032303jes
Date:
January, 2013
File:
PDF, 2.64 MB
english, 2013