Wetting Behavior and Evolution of Microstructure of...

Transactions of the Indian Institute of Metals 2012 / 12 Vol. 65; Iss. 6

Wetting Behavior and Evolution of Microstructure of Sn–3.5Ag Solder Alloy on Electroplated 304 Stainless Steel Substrates

Vignesh U. Nayak, K. N. Prabhu, Nicole Stanford, Satyanarayan
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Volume:
65
Language:
english
DOI:
10.1007/s12666-012-0193-y
Date:
December, 2012
File:
PDF, 393 KB
english, 2012
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