Rapid plasma treatment of polyimide for improved adhesive...

Thin Solid Films 2012 Vol. 521; Iss. none

Rapid plasma treatment of polyimide for improved adhesive and durable copper film deposition

Kenji Usami, Tatsuo Ishijima, Hirotaka Toyoda
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Volume:
521
Year:
2012
Language:
english
DOI:
10.1016/j.tsf.2012.03.080
File:
PDF, 782 KB
english, 2012
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