Moisture diffusion in BCB resins used for MEMS packaging

Microelectronics Reliability 2003 Vol. 43; Iss. 9-11

Moisture diffusion in BCB resins used for MEMS packaging

A. Tetelin, C. Pellet, J-Y. Delétage, B. Carbonne, Y. Danto
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Volume:
43
Year:
2003
DOI:
10.1016/s0026-2714(03)00329-9
File:
PDF, 1.10 MB
2003
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