A Millimeter-Wave System-on-Package Technology Using a...

IEEE Transactions on Advanced Packaging 2009 Vol. 32; Iss. 1

A Millimeter-Wave System-on-Package Technology Using a Thin-Film Substrate With a Flip-Chip Interconnection

Sangsub Song, Youngmin Kim, Jimin Maeng, Heeseok Lee, Youngwoo Kwon, Kwang-Seok Seo
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Volume:
32
Year:
2009
Language:
english
DOI:
10.1109/tadvp.2008.2006626
File:
PDF, 1.63 MB
english, 2009
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