Investigation of the Trace Line Failure Mechanism and...

IEEE Transactions on Advanced Packaging 2009 Vol. 32; Iss. 2

Investigation of the Trace Line Failure Mechanism and Design of Flexible Wafer Level Packaging

Ming-Chih Yew, Yuan, C.C.A., Chung-Jung Wu, Dyi-Chung Hu, Wen-Kun Yang, Kuo-Ning Chiang
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Volume:
32
Year:
2009
Language:
english
DOI:
10.1109/tadvp.2009.2015673
File:
PDF, 1.47 MB
english, 2009
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