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Electromigration Characteristic of SnAgCu Flip Chip Interconnection
Chien-Chen Lee, Chang-Chun Lee, Kuo-Ning ChiangVolume:
33
Year:
2010
Language:
english
DOI:
10.1109/tadvp.2009.2033941
File:
PDF, 2.49 MB
english, 2010