Design and Fabrication of 0/1-Level RF-Via Interconnect for...

IEEE Transactions on Advanced Packaging 2010 Vol. 33; Iss. 1

Design and Fabrication of 0/1-Level RF-Via Interconnect for RF-MEMS Packaging Applications

Li-Han Hsu, Wei-Cheng Wu, Chang, E.Y., Zirath, H., Yun-Chi Wu, Chin-Te Wang, Ching-Ting Lee
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Volume:
33
Year:
2010
Language:
english
DOI:
10.1109/tadvp.2009.2034137
File:
PDF, 2.30 MB
english, 2010
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