Recrystallization, Electric Flame-Off Characteristics, and...

IEEE Transactions on Advanced Packaging 2010 Vol. 33; Iss. 1

Recrystallization, Electric Flame-Off Characteristics, and Electron Backscatter Diffraction of Copper Bonding Wires

Fei-Yi Hung, Truan-Sheng Lui, Li-Hui Chen, Yi-Chang Lin
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Volume:
33
Year:
2010
Language:
english
DOI:
10.1109/tadvp.2009.2034384
File:
PDF, 1.18 MB
english, 2010
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