Development of Empirical Equations for Metal Trace Failure Prediction of Wafer Level Package Under Board Level Drop Test
Chan-Yen Chou, Tuan-Yu Hung, Chao-Jen Huang, Kuo-Ning ChiangVolume:
33
Year:
2010
Language:
english
DOI:
10.1109/tadvp.2010.2042447
File:
PDF, 1.35 MB
english, 2010