Influence of Die Attach Layer on Thermal Performance of...

IEEE Transactions on Components and Packaging Technologies 2010 Vol. 33; Iss. 4

Influence of Die Attach Layer on Thermal Performance of High Power Light Emitting Diodes

Yan, B., Jiun Pyng You, Tran, N.T., Yongzhi He, Shi, F.G.
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Volume:
33
Year:
2010
Language:
english
DOI:
10.1109/tcapt.2009.2032097
File:
PDF, 1.00 MB
english, 2010
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