Silver Microstructure Control for Fluxless Bonding Success...

IEEE Transactions on Components and Packaging Technologies 2010 Vol. 33; Iss. 2

Silver Microstructure Control for Fluxless Bonding Success Using Ag-In System

Wang, P.J., Chu-Hsuan Sha, Lee, C.C.
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Volume:
33
Year:
2010
Language:
english
DOI:
10.1109/tcapt.2009.2038991
File:
PDF, 848 KB
english, 2010
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