Application of Wide-Band Material Characterization Methods...

IEEE Transactions on Electronics Packaging Manufacturing 2010 Vol. 33; Iss. 3

Application of Wide-Band Material Characterization Methods to Printable Electronics

Pynttäri, V.J., Mäkinen, R.M., Palukuru, V.K., Östman, K., Sillanpää, H.P., Kanerva, T., Lepistö, T., Hagberg, J., Jantunen, H.
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Volume:
33
Year:
2010
Language:
english
DOI:
10.1109/tepm.2010.2051809
File:
PDF, 2.06 MB
english, 2010
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