Analysis of transmission line circuits using...

IEEE Transactions on Advanced Packaging 2002 Vol. 25; Iss. 2

Analysis of transmission line circuits using multidimensional model reduction techniques

Gunupudi, P., Khazaka, R., Nakhla, M.
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Volume:
25
Year:
2002
Language:
english
Journal:
IEEE Transactions on Advanced Packaging
DOI:
10.1109/TADVP.2002.803271
File:
PDF, 647 KB
english, 2002
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